Electroplated Copper Additives for Advanced Packaging: A Review

• Lanfeng Guo,
• Shaoping Li,
• Zhaobo He,
• Yanmei Fu,
• Facheng Qiu,
• Renlong Liu,
• Guangzhou Yang

Affiliations

Lanfeng Guo

School of Chemistry and Chemical Engineering, Chongqing University, Chongqing, China

Shaoping Li

Hubei Three Gorges Laboratory, Hubei, China

Zhaobo He

Hubei Sinophorus Electronic Materials Co., Ltd., Hubei, China

Yanmei Fu

Hubei Sinophorus Electronic Materials Co., Ltd., Hubei, China

Facheng Qiu

College of Chemistry and Chemical Engineering, Chongqing University of Technology, Chongqing, China

Renlong Liu

School of Chemistry and Chemical Engineering, Chongqing University, Chongqing, China

Guangzhou Yang

College of Chemistry and Chemical Engineering, Chongqing University of Technology, Chongqing, China