Applied Sciences (Apr 2019)

3D Strain Mapping of Opaque Materials Using an Improved Digital Volumetric Speckle Photography Technique with X-Ray Microtomography

  • Lingtao Mao,
  • Haizhou Liu,
  • Ying Zhu,
  • Ziyan Zhu,
  • Rui Guo,
  • Fu-pen Chiang

DOI
https://doi.org/10.3390/app9071418
Journal volume & issue
Vol. 9, no. 7
p. 1418

Abstract

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Digital volumetric speckle photography (DVSP) method has been used to strain investigation in opaque materials. In this paper, an improved DVSP algorithm is introduced, in which a multi-scale coarse–fine subset calculation process and a subvoxel shifting technique are applied to increase accuracy. We refer to the new algorithm as Multi-scale and Subvoxel shifting Digital Volumetric Speckle Photography (MS-DVSP). The displacement and strain fields of a red sandstone cylinder exposed to uniaxial compression and a woven composite beam under three-point bending are mapped in detail. The characteristics of the interior deformation of the specimens are clearly depicted, thus elucidating the failure mechanism of the materials.

Keywords