Metalurgija (Jan 2022)

Modification of the Cu-ETP copper surface layer with chromium by physical vapor deposition (PvD) and diffusion annealing

  • M. Poreba,
  • M. Pytel,
  • M. Drajewicz,
  • W. Ziaja,
  • M. Góral

Journal volume & issue
Vol. 61, no. 3-4
pp. 673 – 676

Abstract

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In the study, an attempt was made to increase durability of copper by creating a surface layer saturated or supersaturated with chromium only in the area of the highest thermo-mechanical loads during the welding process. There was developed a two-stage technological process, consisting of: application of chrome coating of the thickness approx. 1 µm on the Cu-ETP copper surface using the PVD method, and then performing the process of its diffusion by annealing at a temperature of 950°C in the vacuum. As a result, a diffusion CuCr layer with a thickness of approx. 20 µm was obtained, with hardness of approx. 120 HV0,01.

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