CFD STUDY OF USING DIFFERENT HEAT SINKS FOR ELECTRONIC EQUIPMENTS COOLING

Abstract

Cooling of Electronic equipment’s is an attractiveresearch area in engineering applications. Continuedminimization of electronic system has resulted in dramaticincrease in the amount of heat generated per unit volume, Theaim of this study is to use computational Fluid Dynamics inorder to draw a CFD model for forced cooling conjugate heattransfer analyses in heat generating electronic systems andcompare between a collection of actual commercial heat sinksdifferent from in geometry ,material , and number of fins .Acomplete computer chassis model with heat sinks and fansinside was created and parametric analyses were performed tocompare the effects of different turbulence models, meshresolutions, and radiative heat transfer. The CFD software wasused, ANSYS Icepack 18.0 for preprocessing and fluent forsolution and post processing. The road map was applied to fivedifferent heat sinks and another three heat sink as a validationmodeled into the full chassis. Numerical results were comparedwith the available experimental data and they were in goodagreement.