Platform Tolerant, High Encoding Capacity Dipole Array-Plate Chipless RFID Tags

Abstract

In this paper, we first carry out an in-depth review of the performance parameters of frequencydomain chipless RFID transponders in terms of their spatial density, spectral capacity, and comprehensive encoding capacity (bit/λ2/GHz) comprising both spatial and spectral performance, and platform tolerance. Secondly, we theoretically and numerically investigate the recently introduced and promising concept of the platform-tolerant chipless RFID transponder based on a detuned dipole array-plate that provides high encoding capacity. We propose, fabricate and measure a 20-bit transponder consisting of an array of 20 detuned dipoles closely coupled to a 60 × 60 mm2 metallic plate. The radar cross section at the level of -15 dBsm exhibits reliably recognizable minima corresponding to individual dipole resonances. When compared to other published frequency-domain chipless RFID transponders, the encoding capacity reaches 47.4 bit/λ2/GHz, which constitutes one of the highest values, while achieving a concurrently high level of radar cross section (RCS) reflection response and platform tolerance performance. The measurements confirm very good performance parameters in the cases when the transponder is attached to various packaging materials, such as cardboard, plastic, wood, metal or a human body phantom. The essential benefits of the presented solution include a very good frequency and amplitude stability in the RCS response, which enables a reliable reading of encoded information (if zero bits are coded). The double layer metallization represents an inherent property of the proposed solution, which is a necessary trade-off for high encoding capacity and contemporary platform tolerance.

Keywords

• Chipless radiofrequency identification
• coding capacity
• coupled modes theory
• dipole scatterer
• electromagnetic band-gap
• high impedance surfaces