Editorial for the Special Issue “MEMS Packaging Technologies and 3D Integration”

Seonho Seok

doi:10.3390/mi13050749

Micromachines (May 2022)

Editorial for the Special Issue “MEMS Packaging Technologies and 3D Integration”

Seonho Seok

Affiliations

Seonho Seok: Center for Nanoscience and Nanotechnology (C2N), University-Paris-Saclay, 91400 Orsay, France

DOI: https://doi.org/10.3390/mi13050749
Journal volume & issue: Vol. 13, no. 5
p. 749

Abstract

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As fabrication technologies advance, the packaging of MEMS device is being developed in two main directions: MEMS device packaging and MEMS or sensor system integration [...]

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Published in Micromachines

ISSN: 2072-666X (Online)
Publisher: MDPI AG
Country of publisher: Switzerland
LCC subjects: Technology: Mechanical engineering and machinery
Website: https://www.mdpi.com/journal/micromachines

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