APL Materials (Aug 2020)
Cation diffusion in polycrystalline thin films of monoclinic HfO2 deposited by atomic layer deposition
Abstract
Though present in small amounts and migrating at low rates, intrinsic cation defects play a central role in governing the operational lifetime of oxide-ion conducting materials through slow degradation processes such as interdiffusion, kinetic demixing, grain growth, and creep. In this study, a new experimental approach to characterizing the behavior of such slow-moving, minority defects is presented. Diffusion is probed in samples with a constant cation-defect concentration well above the equilibrium values. This approach is applied to monoclinic hafnium dioxide, m-HfO2. To this end, nanocrystalline thin films of m-HfO2 were prepared by atomic layer deposition. Diffusion experiments with ZrO2 as a diffusion source were performed in the temperature range 1173 ≤ T/K ≤ 1323 in air. The Zr diffusion profiles obtained subsequently by secondary ion mass spectrometry exhibited the following two features: the first feature was attributed to slow bulk diffusion and the second was attributed to combined fast grain-boundary diffusion and slow bulk diffusion. The activation enthalpy of Zr diffusion in bulk HfO2 was found to be (2.1 ± 0.2) eV. This result is consistent with the density-functional-theory calculations of hafnium-vacancy migration in m-HfO2, which yield values of ∼2 eV for a specific path. The activation enthalpy of the grain-boundary diffusion of (2.1 ± 0.3) eV is equal to that for bulk diffusion. This behavior is interpreted in terms of enhanced cation diffusion along space-charge layers.