Ultra-High Light Extraction Efficiency and Ultra-Thin Mini-LED Solution by Freeform Surface Chip Scale Package Array

Che-Hsuan Huang; Chieh-Yu Kang; Shu-Hsiu Chang; Chih-Hao Lin; Chun-Yu Lin; Tingzhu Wu; Chin-Wei Sher; Chien-Chung Lin; Po-Tsung Lee; Hao-Chung Kuo

doi:10.3390/cryst9040202

Crystals (Apr 2019)

Ultra-High Light Extraction Efficiency and Ultra-Thin Mini-LED Solution by Freeform Surface Chip Scale Package Array

Che-Hsuan Huang,
Chieh-Yu Kang,
Shu-Hsiu Chang,
Chih-Hao Lin,
Chun-Yu Lin,
Tingzhu Wu,
Chin-Wei Sher,
Chien-Chung Lin,
Po-Tsung Lee,
Hao-Chung Kuo

Affiliations

Che-Hsuan Huang: Department of Photonics and Institute of Electro-Optical Engineering, College of Electrical and Computer Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan
Chieh-Yu Kang: Department of Photonics and Institute of Electro-Optical Engineering, College of Electrical and Computer Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan
Shu-Hsiu Chang: LEDA-creative Co., Ltd., No.45, Zhengyi Rd., Pingzhen Dist., Taoyuan City 32457, Taiwan
Chih-Hao Lin: Department of Photonics and Institute of Electro-Optical Engineering, College of Electrical and Computer Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan
Chun-Yu Lin: LEDA-creative Co., Ltd., No.45, Zhengyi Rd., Pingzhen Dist., Taoyuan City 32457, Taiwan
Tingzhu Wu: Department of Electronic Science, Fujian Engineering Research Center for Solid-State Lighting, Xiamen University, Xiamen 361005, China
Chin-Wei Sher: Department of Photonics and Institute of Electro-Optical Engineering, College of Electrical and Computer Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan
Chien-Chung Lin: Institute of Photonic System, National Chiao Tung University, Tainan 711, Taiwan
Po-Tsung Lee: Department of Photonics and Institute of Electro-Optical Engineering, College of Electrical and Computer Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan
Hao-Chung Kuo: Department of Photonics and Institute of Electro-Optical Engineering, College of Electrical and Computer Engineering, National Chiao Tung University, Hsinchu 30010, Taiwan

DOI: https://doi.org/10.3390/cryst9040202
Journal volume & issue: Vol. 9, no. 4
p. 202

Abstract

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In this study, we present a novel type of package, freeform-designed chip scale package (FDCSP), which has ultra-high light extraction efficiency and bat-wing light field. For the backlight application, mainstream solutions are chip-scale package (CSP) and surface-mount device package (SMD). Comparing with these two mainstream types of package, the light extraction efficiency of CSP, SMD, and FDCSP are 88%, 60%, and 96%, respectively. In addition to ultra-high light extraction efficiency, because of the 160-degree bat-wing light field, FDCSP could provide a thinner and low power consumption mini-LED solution with a smaller number of LEDs than CSP and SMD light source array.

Published in Crystals

ISSN: 2073-4352 (Online)
Publisher: MDPI AG
Country of publisher: Switzerland
LCC subjects: Science: Chemistry: Crystallography
Website: http://www.mdpi.com/journal/crystals/

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