Inkjet Printing on a New Flexible Ceramic Substrate for Internet of Things (IoT) Applications

Abstract

In this article, the optimization of printing properties on a new, flexible ceramic substrate is reported for sensing and antenna applications encompassing internet of things (IoT) devices. E-Strate® is a commercially available, non-rigid, thin ceramic substrate for implementing in room temperature and high-temperature devices. In this substrate, the printing parameters like drop spacing, number of printed layers, sintering temperature, and sintering time were varied to ensure an electrically conductive and repeatable pattern. The test patterns were printed using silver nanoparticle ink and a Dimatix 2831 inkjet printer. Electrical conductivity, high-temperature tolerance, bending, and adhesion were investigated on the printed samples. The three-factor factorial design analysis showed that the number of printed layers, sintering temperature, sintering time, and their interactions were significant factors affecting electrical conductivity. The optimum printing parameters for the thin E-Strate® substrate were found to be 20 μm drop spacing, three layers of printing, and 300 °C sintering temperature for 30 min. The high-temperature tolerance test indicated a stable pattern without any electrical degradation. Repetitive bending, adhesion test, and ASTM tape tests showed adequate mechanical stability of the pattern. These results will provide insight for investigators interested in fabricating new IoT devices.

Keywords

• printing parameters
• sintering
• curing
• electrical resistivity analysis of silver nanoparticles
• IoT
• bending analysis