Nano-Micro Letters (Dec 2022)

Ultralow Interfacial Thermal Resistance of Graphene Thermal Interface Materials with Surface Metal Liquefaction

  • Wen Dai,
  • Xing-Jie Ren,
  • Qingwei Yan,
  • Shengding Wang,
  • Mingyang Yang,
  • Le Lv,
  • Junfeng Ying,
  • Lu Chen,
  • Peidi Tao,
  • Liwen Sun,
  • Chen Xue,
  • Jinhong Yu,
  • Chengyi Song,
  • Kazuhito Nishimura,
  • Nan Jiang,
  • Cheng-Te Lin

DOI
https://doi.org/10.1007/s40820-022-00979-2
Journal volume & issue
Vol. 15, no. 1
pp. 1 – 14

Abstract

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Highlights A three-tiered thermal interface materials was proposed with the through-plane thermal conductivity up to176 W m−1 K−1 and contact thermal resistance as low as 4–6 K mm2 W−1 (double sides). The liquid metal acts as a buffer layer to connect vertically aligned graphene with the rough heater/heat sink, improving effective contact thermal conductance by more than an order of magnitude.

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