Residual Stress in Glass Components

Abstract

Architectural trends have tended towards curved glass envelopes and maximised transparency by reducing solid fixing areas. One approach towards transparent glass connections is a heat bonding process based on the principles of welding. This paper investigates the level of residual stress in soda lime silica and borosilicate glass caused by a heat-based connection or forming process. Nominal levels of residual stress prior to heat impact, directly after heat impact and after annealing will be measured on small-scale samples, utilizing a scattered light polariscope (SCALP). Material properties the large temperature range required for the heat bonding process have been identified to allow subsequent numerical modelling to verify the results obtained in this study.