Modelling of Transmission Lines Inside Modern Integrated Semiconductor and Test Boards

Abstract

The main purpose of this paper is to present the methodology for calculating the electromagnetic behaviour of real integrated circuit (IC) parts using a no-mesh local Finite Differential Method (FDM). Furthermore, the comparison of computational results and measurements is presented. All considerations are based on typical long transmission lines (TLs) in modern ICs. The obtained results have been analysed in detail and compared with measured values. The measurement data are de-embedded using the test board model. This problem is illustrated in this paper based on a practical example of the Multi-Conductor Transmission Lines test structure whose electrical responses to various excitations are presented and analysed in detail.

Keywords

• Integrated circuits
• no-mesh FDM
• transmission line
• microwave
• de-embedding
• conductor-backed coplanar waveguide