Bonded cylindrical Terfenol-D-epoxy/PZT magnetoelectric composites prepared by the one-step compression molding

Yang Song; De’an Pan; Jiao Wang; Zhijun Zuo; Shengen Zhang; Bo Liu; Alex A. Volinsky

doi:10.1063/1.4914106

AIP Advances (Mar 2015)

Bonded cylindrical Terfenol-D-epoxy/PZT magnetoelectric composites prepared by the one-step compression molding

Yang Song,
De’an Pan,
Jiao Wang,
Zhijun Zuo,
Shengen Zhang,
Bo Liu,
Alex A. Volinsky

Affiliations

Yang Song: Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China
De’an Pan: Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China
Jiao Wang: Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China
Zhijun Zuo: Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China
Shengen Zhang: Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China
Bo Liu: Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China
Alex A. Volinsky: Department of Mechanical Engineering, University of South Florida, Tampa, Florida 33620, USA

DOI: https://doi.org/10.1063/1.4914106
Journal volume & issue: Vol. 5, no. 3
pp. 037104 – 037104-5

Abstract

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Magnetoelectric composites with bonded Terfenol-D-epoxy (TDE) and PZT cylindrical ceramics were prepared by the one-step compression molding at room temperature. The PZT cylindrical ceramics not only provided the piezoelectric phase, but also acted as a mold for TDE. The axial ME voltage coefficient of the cylindrical composites, αE,A, was studied. By contrast, the new structure has a larger ME voltage coefficient compared with the effective planar laminated composites due to the self-bound state. This study decreases the ME composite dimensions, making it a promising candidate for the magnetic field sensor applications.

Published in AIP Advances

ISSN: 2158-3226 (Online)
Publisher: AIP Publishing LLC
Country of publisher: United States
LCC subjects: Science: Physics
Website: http://aipadvances.aip.org/

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