Micromachines (Jun 2023)

Numerical Simulation of Deformation in Hot Runner Manifold

  • Jae Sung Jung,
  • Sun Kyoung Kim

DOI
https://doi.org/10.3390/mi14071337
Journal volume & issue
Vol. 14, no. 7
p. 1337

Abstract

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This study simulated the deformation of a hot runner manifold and nozzle assembly during operation, aiming to address potential leaks and premature failure. Both thermal and mechanical models were used simultaneously to accurately capture system behavior. A simplified set of boundary conditions was proposed for efficient problem-solving. Analysis of the simulation results revealed that thermal deformation posed a risk of catastrophic failures and leaks. Deformation from melt pressure was relatively small compared to thermal loading, not exceeding 12%. The study provided design recommendations based on the simulation findings, guiding the development of hot runner systems for improved reliability.

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