Nature Communications (Apr 2022)
Non-invasive digital etching of van der Waals semiconductors
- Jian Zhou,
- Chunchen Zhang,
- Li Shi,
- Xiaoqing Chen,
- Tae Soo Kim,
- Minseung Gyeon,
- Jian Chen,
- Jinlan Wang,
- Linwei Yu,
- Xinran Wang,
- Kibum Kang,
- Emanuele Orgiu,
- Paolo Samorì,
- Kenji Watanabe,
- Takashi Taniguchi,
- Kazuhito Tsukagoshi,
- Peng Wang,
- Yi Shi,
- Songlin Li
Affiliations
- Jian Zhou
- National Laboratory of Solid-State Microstructures and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
- Chunchen Zhang
- National Laboratory of Solid-State Microstructures and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
- Li Shi
- Department of Physics, Southeast University
- Xiaoqing Chen
- National Laboratory of Solid-State Microstructures and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
- Tae Soo Kim
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology
- Minseung Gyeon
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology
- Jian Chen
- National Laboratory of Solid-State Microstructures and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
- Jinlan Wang
- Department of Physics, Southeast University
- Linwei Yu
- National Laboratory of Solid-State Microstructures and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
- Xinran Wang
- National Laboratory of Solid-State Microstructures and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
- Kibum Kang
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology
- Emanuele Orgiu
- Institut national de la recherche scientifique, Centre Énergie Matériaux Télécommunications
- Paolo Samorì
- University of Strasbourg, CNRS, ISIS UMR 7006
- Kenji Watanabe
- WPI-MANA, National Institute for Materials Science
- Takashi Taniguchi
- WPI-MANA, National Institute for Materials Science
- Kazuhito Tsukagoshi
- WPI-MANA, National Institute for Materials Science
- Peng Wang
- National Laboratory of Solid-State Microstructures and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
- Yi Shi
- National Laboratory of Solid-State Microstructures and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
- Songlin Li
- National Laboratory of Solid-State Microstructures and Collaborative Innovation Center of Advanced Microstructures, Nanjing University
- DOI
- https://doi.org/10.1038/s41467-022-29447-6
- Journal volume & issue
-
Vol. 13,
no. 1
pp. 1 – 8
Abstract
Here, the authors exploit a non-invasive layer-bylayer etching technique to fabricate electronic devices based on 2D transition metal dichalcogenides with controlled thickness and transport properties comparable to those of exfoliated flakes.
