Mini-Review: Modeling and Performance Analysis of Nanocarbon Interconnects

Abstract

As the interconnect delay exceeds the gate delay, the integrated circuit (IC) technology has evolved from a transistor-centric era to an interconnect-centric era. Conventional metallic interconnects face several serious challenges in aspects of performance and reliability. To address these issues, nanocarbon materials, including carbon nanotube (CNT) and graphene, have been proposed as promising candidates for interconnect applications. Considering the rapid development of nanocarbon interconnects, this paper is dedicated to providing a mini-review on our previous work and on related research in this field.

Keywords

• carbon nanotube (CNT)
• graphene nanoribbon (GNR)
• circuit modeling
• interconnects
• nanocarbon
• electrothermal co-simulation