Advanced RF filters for wireless communications

Kai Yang; Chenggong He; Jiming Fang; Xinhui Cui; Haiding Sun; Yansong Yang; Chengjie Zuo

Chip (Dec 2023)

Advanced RF filters for wireless communications

Kai Yang,
Chenggong He,
Jiming Fang,
Xinhui Cui,
Haiding Sun,
Yansong Yang,
Chengjie Zuo

Affiliations

Kai Yang: School of Microelectronics, University of Science and Technology of China, Hefei 230088, China
Chenggong He: YUNTA Technologies and ANUKI Technologies, Hefei 230088, China
Jiming Fang: School of Microelectronics, University of Science and Technology of China, Hefei 230088, China
Xinhui Cui: School of Microelectronics, University of Science and Technology of China, Hefei 230088, China
Haiding Sun: School of Microelectronics, University of Science and Technology of China, Hefei 230088, China; Corresponding authors
Yansong Yang: Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong 999077, China; Corresponding authors
Chengjie Zuo: School of Microelectronics, University of Science and Technology of China, Hefei 230088, China; YUNTA Technologies and ANUKI Technologies, Hefei 230088, China; Corresponding authors

Journal volume & issue: Vol. 2, no. 4
p. 100058

Abstract

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ABSTRACT: This paper provides a comprehensive review of advanced radio frequency (RF) filter technologies available in miniature chip or integrated circuit (IC) form for wireless communication applications. The RF filter technologies were organized according to the timeline of their introduction, in conjunction with each generation of wireless (cellular) communication standards (1G to 5G). This approach enabled a clear explanation of the corresponding invention history, working principles, typical applications and future development trends. The article covered commercially successful acoustic filter technologies, including the widely used surface acoustic wave (SAW) and bulk acoustic wave (BAW) filters, as well as electromagnetic filter technologies based on low-temperature co-fired ceramic (LTCC) and integrated passive device (IPD). Additionally, emerging filter technologies such as IHP-SAW, suspended thin-film lithium niobate (LiNbO3 or LN) resonant devices and hybrid were also discussed. In order to achieve higher performance, smaller form factor and lower cost for the wireless communication industry, it is believed that fundamental breakthroughs in materials and fabrication techniques are necessary for the future development of RF filters.

Published in Chip

ISSN: 2709-4723 (Print); 2772-2724 (Online)
Publisher: Elsevier
Country of publisher: Netherlands
LCC subjects: Technology: Technology (General): Industrial engineering. Management engineering: Information technology
Website: https://www.sciencedirect.com/journal/chip

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