Poultry Science (Feb 2023)

The effects of sous-vide, microwave cooking and stewing of goose meat on fatty acid profile and lipid indices

  • Monika Wereńska,
  • J. Wołoszyn,
  • A. Okruszek,
  • W. Marcinkowska,
  • G. Haraf

Journal volume & issue
Vol. 102, no. 2
p. 102337

Abstract

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ABSTRACT: The effect of sous-vide (S-V), microwave cooking (M) and stewing (S) on the fatty acid profile and lipid indices of goose meat was investigated. The research material involved breast muscles (24 with skin and 24 without skin) cut from carcasses of 17-week-old females “Polish oat geese.” Gas chromatography was used to establish the fatty acid profile and lipid indices were calculated. The kind of heat treatment and the type of goose meat (muscles with- and without skin) affected the fatty acid profile and lipid indices. The sum of SFA was higher in S-V, M, and S samples for both kinds of meat than in raw ones. The cooked samples with skin had a lower percentage of Ʃ SFA than the skinless meat. S-V and M cooking (for meat with skin) caused an increase, while in the case of S heating (for both kinds of meat) there were no significant differences in Ʃ MUFA compared to raw samples. The S-V, M, and S meat with skin was characterized by a higher value of Ʃ MUFA than skinless ones. The Ʃ PUFA was lower in S-V and M than in raw meat, wherein this decline was higher for M ones (for both kinds of meat). The M meat with skin had the lowest and S without skin the highest share of Σ PUFA. Heat treatment caused an increase in Σ PUFA n-6/n-3 ratio, the lowest value was shown by the S-V muscles. Sous-vide cooking was more beneficial for consumers than the remaining methods in terms of Σ DFA/Σ OFA, Σ UFA/Σ SFA, NVI, health-promoting index (HPI), inflammatory biomarker indexes, and Σ SFA, Σ OFA, Σ UFA, Σ DFA values for meat with skin (but not all of these were significant). In turn, stewing of meat without skin was more favorable than S-V and microwave cooking in relation to indexes such as: Σ DFA/Σ OFA, Σ UFA/Σ SFA, Σ PUFA/Σ SFA, PI, UI, AI, TI, HPI.

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