Strain Measurements within Fibreboard. Part III: Analyzing the Process Zone at the Crack Tip of Medium Density Fiberboards (MDF) Double Cantilever I-Beam Specimens

Abstract

This paper is the third part of a study dealing with the mechanical and fracture mechanical characterization of Medium Density Fiberboards (MDF). In the first part, an analysis of internal bond strength testing was performed and in the second part MDF was analyzed by means of the wedge splitting experiment; this part deals with the double cantilever I beam test, which is designed for measuring the fracture energy as well as stress intensity factor in Mode I. For a comparison of isotropic and orthotropic material behavior, finite element modeling was performed. In addition to the calculation of fracture energy the stress intensity factor was analyzed by means of finite elements simulation and calculation. In order to analyze strain deformations and the process zone, electronic speckle pattern interferometry measurements were performed. The results revealed an elongated process zone and lower results for KIC if compared to the wedge splitting experiment. The Gf numbers are higher compared to the wedge splitting results and can be explained by the thicker process zone formed during the crack propagation. The process zone width on its part is influenced by the stiff reinforcements and yields a similar crack surface as with the internal bond test.

Keywords

• double cantilever I-beam test
• electronic speckle pattern interferometry
• fracture mechanics
• fracture energy
• medium density fiber board