Develop asymmetric, interference-free and excellent heat-dissipation CPU cooler

Abstract

This study designed an asymmetric, interference-free and excellent heat dissipation performance CPU cooler. Due to the increasing size of the motherboard cooler, the heat pipes or aluminum fins of the CPU cooler may interfere with the motherboard or the graphics card, thus preventing smooth installation. The proposed tower-type cooler avoids this problem by offsetting the aluminum fins and bending the heat pipes away from the motherboard, ensuring compatibility with the motherboard, memory, graphics card, and other components. Combining the heat pipes, copper base, and aluminum base requires careful consideration of tolerance. The heat pipes are composed of copper tubes, copper powder, and pure water, then vacuum treated. The copper tubes are filled with copper powder and sintered (900 °C–1000 °C) to inject pure water and vacuum seal once more, then bent according to the design. The aluminum fins are stamped from sheet metal. After nickel plating, they facilitate welding between copper and aluminum materials. The CPU cooler developed in this study includes the design, drawing, fabrication, and assembly of each component (finning, tubing, soldering). It demonstrates successful installation on most commercial motherboards. Compared with commercially available coolers, the temperature of the cooler developed in this study is reduced by about 1∼2 °C.

Keywords

• Tower cooler
• Heat conduction
• Heat pipe
• Sheet metal forming