Multi-material additive manufacturing of electronics components: A bibliometric analysis

Abstract

The study presents a bibliometric analysis of studies conducted on multi-materials printing of electronic components via additive manufacturing technologies. Using the R package and the associated biblioshiny, the study analyzed publications from Web of Science and Scopus. The study analyzed 405 research articles after removing 104 duplicates. The study applied performance analysis, keyword analysis, and network analysis. The performance analysis showed that the publications on multi-materials additive manufacturing are multi-disciplinary. Whilst the publications span almost three decades, most contributions started after 2015. The United States of America is the country with the highest production. The keyword analysis showed a changed focus before and after 2015. The trending topics show that the most recent trend is in the ‘aerospace industry’. Finally, the thematic analysis shows that the emerging themes in the area are interfaces, moisture, diffusion, microstructure, mechanical properties, and powder metallurgy. These emerging themes are discussed as they are conceived as the future directions of multi-materials printing of electronic components and devices. The current trend of research focuses on understanding and improving the interfacial bonding between the various multi-material interfaces. Overcoming the weak interfacial bonding issues would improve the mechanical properties of multi-materials electronic components.

Keywords

• Multi-materials
• Additive manufacturing
• Interfacial bond
• Electronic components
• Dissimilar materials
• Mechanical interlocking