Polymers (Jun 2023)

Production of Blended Poly(acrylonitrile): Poly(ethylenedioxythiophene):Poly(styrene sulfonate) Electrospun Fibers for Neural Applications

  • Fábio F. F. Garrudo,
  • Giulia Filippone,
  • Leonor Resina,
  • João C. Silva,
  • Frederico Barbosa,
  • Luís F. V. Ferreira,
  • Teresa Esteves,
  • Ana Clara Marques,
  • Jorge Morgado,
  • Frederico Castelo Ferreira

DOI
https://doi.org/10.3390/polym15132760
Journal volume & issue
Vol. 15, no. 13
p. 2760

Abstract

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This study describes, for the first time, the successful incorporation of poly(ethylenedioxythiophene):poly(styrene sulfonate) (PEDOT:PSS) in Poly(acrylonitrile) (PAN) fibers. While electroconductive PEDOT:PSS is extremely challenging to electrospun into fibers. Therefore, PAN, a polymer easy to electrospun, was chosen as a carrier due to its biocompatibility and tunable chemical stability when cross-linked, particularly using strong acids. PAN:PEDOT:PSS blends, prepared from PEDOT:PSS Clevios PH1000, were electrospun into fibers (PH1000) with a diameter of 515 ± 120 nm, which after being thermally annealed (PH1000 24H) and treated with heated sulfuric acid (PH1000 H2SO4), resulted in fibers with diameters of 437 ± 109 and 940 ± 210 nm, respectively. The fibers obtained over the stepwise process were characterized through infra-red/Raman spectroscopy and cyclic voltammetry. The final fiber meshes showed enhanced electroconductivity (3.2 × 10−3 S cm−1, four-points-assay). Fiber meshes biocompatibility was evaluated using fibroblasts and neural stem cells (NSCs) following, respectively, the ISO10993 guidelines and standard adhesion/proliferation assay. NSCs cultured on PH1000 H2SO4 fibers presented normal morphology and high proliferation rates (0.37 day−1 vs. 0.16 day−1 for culture plate), indicating high biocompatibility for NSCs. Still, the low initial NSC adhesion of 7% calls for improving seeding methodologies. PAN:PEDOT:PSS fibers, here successful produced for the first time, have potential applications in neural tissue engineering and soft electronics.

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