Effect of different titanium addition methods on the properties of diamond/Cu composites

Abstract

Due to the low bonding strength between diamond and copper, the thermal conductivity and mechanical strength of diamond/copper composites are affected. In order to improve the interface bonding strength, this paper prepared diamond/Cu composites with titanium element in two forms: adding titanium to the copper matrix and using titanium coated diamond particles, respectively. The microstructure and composition analysis of the materials were carried out through SEM, EDS, AFM, etc. The bending strength and thermal conductivity of titanium coated diamond/copper composites reached 230 MPa and 480 W/(m·K), respectively, which were higher than the bending strength and thermal conductivity of diamond/Cu composites with added titanium in the matrix (208 MPa and 127 W/(m·K) and significantly higher than the corresponding properties of pure diamond/Cu composites (69 MPa and 108 W/(m·K)). Pre coating a layer of titanium carbide on the surface of diamond can serve as a connecting bridge, effectively reducing interfacial thermal resistance and improving mechanical properties, which is more effective than adding titanium powder to the matrix to improve the bending strength and thermal conductivity of diamond/Cu composites.

Keywords

• Titanium
• Diamond/Cu
• Bending strength
• Thermal conductivity
• Interface