Electrochem (Jun 2024)

Supercritical CO<sub>2</sub>-Assisted Electroless Plating of Ultrahigh-Molecular-Weight Polyethylene Filaments for Weavable Device Application

  • Hikaru Kondo,
  • Tomoyuki Kurioka,
  • Wan-Ting Chiu,
  • Chun-Yi Chen,
  • Jhen-Yang Wu,
  • Tso-Fu Mark Chang,
  • Machiko Yamaguchi,
  • Hiromichi Kurosu,
  • Masato Sone

DOI
https://doi.org/10.3390/electrochem5020013
Journal volume & issue
Vol. 5, no. 2
pp. 213 – 222

Abstract

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This study reports on the use of supercritical CO2 (scCO2) for the metallization of ultrahigh-molecular-weight polyethylene (UHMW-PE) filaments, which are used as functional components in weavable devices. UHMW-PE is well known for its chemical and impact resistance, making it suitable for use in bulletproof clothing and shields. However, its chemical resistance poses a challenge for metallization. By utilizing scCO2 as the solvent in the catalyzation process, a uniform and defect-free layer of Ni-P is successfully deposited on the UHMW-PE filaments. The deposition rate of Ni-P is enhanced at higher temperatures during the scCO2 catalyzation. Importantly, the durability of the Ni-P-metalized UHMW-PE filaments is improved when the scCO2 catalyzation is carried out at 120 °C, as evidenced by minimal changes in electrical resistivity after a rolling test.

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