Jisuanji kexue yu tansuo (Aug 2020)

Research on Design Pattern of Electro-thermal Multi-physical Coupling Simulation Software

  • GONG Ping, ZHENG Yuteng, ZHANG Aiqing

DOI
https://doi.org/10.3778/j.issn.1673-9418.1909073
Journal volume & issue
Vol. 14, no. 8
pp. 1298 – 1306

Abstract

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The numerical simulation of multi-physical fields like the electric field and the thermal field is a more and more important means of the integrated circuit design in the field of the microelectronics. It involves many kinds of multi-physical fields and analysis, such as electro-thermal fields, electro-thermal-mechanical fields, static analysis, transient analysis and time-harmonic analysis. In order to meet the diverse requirements of the numerical simulation of multi-physical fields and analysis, how to quickly develop a batch of electrothermal multi-physical fields softwares is a challenging problem. Software reuse is the key to solve this problem. This paper presents a software design model that develops software components of mathematical and physical equations. First of all, this paper implements current continuity equation component and steady-state heat balance equation component to solve the reusability problem of single physical field solver. Then, this paper designs the method of multi-physics field calculation process based on free assembling single-physical-field equation components, which supports the custom development of multi-physics coupled field softwares. Moreover, this mode is suitable for parallel computing. Through developing the two customized typical electro-thermal coupled parallel application software, the code reuse rates reach more than 85%, which verifies the validity of the software design model.

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