Nanoparticle-reinforced solder alloys: A comprehensive review of recent formulation properties, and mechanical performance

Abstract

This review presents a comprehensive analysis of the recent formulation of nanoparticle-reinforced solder alloys, focusing on their main properties and improvements in mechanical performance. The introduction provides an overview of solder alloys and the concept of formulating nanoparticle-reinforced solder alloys. The discussion systematically reviews the importance of various properties and critically evaluates the findings from the literature. The review compares and synthesizes the outcomes and insights regarding the impact of nanoparticle addition on the properties and performance of the resulting composite solder alloys. The aim is to identify recent trends, scientific challenges, limitations, and potential breakthroughs in the current formulation of nanoparticle-reinforced solder alloys. The key value of this review lies in the compilation of the latest reports and technical setups, along with the authors' critical analysis and perceptions. This review provides an in-depth understanding and guidance for formulating novel and high-performance nanoparticle-reinforced solder alloys, making it a valuable resource for researchers and engineers in the field of advanced soldering materials.

Keywords

• Nanoparticles
• Lead-free solders
• Characterization
• Mechanical properties