Materials (Jan 2021)

Generation of Self-Assembled 3D Network in TPU by Insertion of Al<sub>2</sub>O<sub>3</sub>/<i>h</i>-BN Hybrid for Thermal Conductivity Enhancement

  • Kai-Han Su,
  • Cherng-Yuh Su,
  • Po-Wei Chi,
  • Prem Chandan,
  • Cheng-Ta Cho,
  • Wan-Yu Chi,
  • Maw-Kuen Wu

DOI
https://doi.org/10.3390/ma14020238
Journal volume & issue
Vol. 14, no. 2
p. 238

Abstract

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Thermal management has become one of the crucial factors in designing electronic equipment and therefore creating composites with high thermal conductivity is necessary. In this work, a new insight on hybrid filler strategy is proposed to enhance the thermal conductivity in Thermoplastic polyurethanes (TPU). Firstly, spherical aluminium oxide/hexagonal boron nitride (ABN) functional hybrid fillers are synthesized by the spray drying process. Then, ABN/TPU thermally conductive composite material is produced by melt mixing and hot pressing. Then, ABN/TPU thermally conductive composite material is produced by melt mixing and hot pressing. Our results demonstrate that the incorporation of spherical hybrid ABN filler assists in the formation of a three-dimensional continuous heat conduction structure that enhances the thermal conductivity of the neat thermoplastic TPU matrix. Hence, we present a valuable method for preparing the thermal interface materials (TIMs) with high thermal conductivity, and this method can also be applied to large-scale manufacturing.

Keywords