Journal of Microelectronic Manufacturing (Aug 2018)

Analysis of Current Research Status of Plasma Etch Process Model

  • Xiaoting Li,
  • Rui Chen,
  • Lei Qu,
  • Xuanmin Zhu,
  • Jing Zhang,
  • Yanrong Wang,
  • Shuhua Wei,
  • Jiang Yan,
  • Yayi Wei

DOI
https://doi.org/10.33079/jomm.18010104
Journal volume & issue
Vol. 1, no. 1

Abstract

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This paper summarizes the status of the plasma etch process modeling research. It mainly introduces typical etching models employing the analytical method, geometric method, system identification method, basic principle simulation method, as well as empirical model. Each model’s basic principles, application scopes, advantages and disadvantages are discussed. Based on these, the development history of the etch process modeling is summarized, and the development opportunities of the etch model are prospected. This paper provides a brief view for establishment of the plasma etching process model.

Keywords