IEEE Journal of the Electron Devices Society (Jan 2019)

An Novel Thin Layer SOI Carrier-Stored Trench LIGBT With Enhanced Emitter Injection

  • Bo Yi,
  • Jia Lin,
  • Jiayu Wu,
  • Moufu Kong,
  • Xingbi Chen

DOI
https://doi.org/10.1109/JEDS.2019.2941907
Journal volume & issue
Vol. 7
pp. 936 – 942

Abstract

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An novel thin layer SOI carrier-stored (CS) trench lateral insulated gate bipolar transistor (TLIGBT) with diode-clamped P-shield layer is proposed. The potential of the P-shield layer is clamped by two series-connected diodes. Therefore, the reverse voltage is sustained by the P-shield/Ndrift junction rather than the P-base/CS junction during the off-state. Thus, the doping concentration of the carrier-stored layer (Ncs) can be significantly improved without compromising the breakdown voltage. Hence, an ultra-low on-state voltage drop (Von) can be obtained. Besides, the two series-connected diodes clamp the drain-to-source voltage of the intrinsic n-MOS in the TLIGBT, which leads to an ultra-low saturation current and improves the short-circuit withstand capability. The simulation results indicate that the turn-off loss (Eoff) at Von = 1.37 V is reduced by 28.8% and 21% compared with those of the conventional carrier-stored LIGBT A and LIGBT B, respectively. Moreover, the saturation current density is reduced by over 53.3% and the short circuit withstand time is improved by more than 2 times than those of the conventional and state-of-the-arts.

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