IEEE Journal of the Electron Devices Society (Jan 2018)

A Method to Reduce Forming Voltage Without Degrading Device Performance in Hafnium Oxide-Based 1T1R Resistive Random Access Memory

  • Yu-Ting Su,
  • Hsi-Wen Liu,
  • Po-Hsun Chen,
  • Ting-Chang Chang,
  • Tsung-Ming Tsai,
  • Tian-Jian Chu,
  • Chih-Hung Pan,
  • Cheng-Hsien Wu,
  • Chih-Cheng Yang,
  • Min-Chuan Wang,
  • Shengdong Zhang,
  • Hao Wang,
  • Simon M. Sze

DOI
https://doi.org/10.1109/JEDS.2018.2805285
Journal volume & issue
Vol. 6
pp. 341 – 345

Abstract

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In this paper, we discover an operation method that can effectively decrease the forming voltage in resistance random access memory (RRAM). Forming voltage can be reduced by either increasing the rising time of the forming-waveform or by increasing the temperature in the forming process. However, the resulting electronic RRAM characteristics after each of these methods differ. While increasing the rising time causes greater damage to the switching layer due to longer accumulation of charge, increasing temperature in the forming process does not. The high temperature-formed RRAM excels in retention and endurance tests, proving an effective means to decrease forming voltage.

Keywords