IEEE Journal of the Electron Devices Society (Jan 2019)

A <inline-formula> <tex-math notation="LaTeX">${c}$ </tex-math></inline-formula>-Axis-Aligned Crystalline In-Ga-Zn Oxide FET With a Gate Length of 21 nm Suitable for Memory Applications

  • Hitoshi Kunitake,
  • Kazuaki Ohshima,
  • Kazuki Tsuda,
  • Noriko Matsumoto,
  • Tatsuki Koshida,
  • Satoru Ohshita,
  • Hiromi Sawai,
  • Yuichi Yanagisawa,
  • Shiori Saga,
  • Ryo Arasawa,
  • Takako Seki,
  • Ryunosuke Honda,
  • Haruyuki Baba,
  • Daigo Shimada,
  • Hajime Kimura,
  • Ryo Tokumaru,
  • Tomoaki Atsumi,
  • Kiyoshi Kato,
  • Shunpei Yamazaki

DOI
https://doi.org/10.1109/JEDS.2019.2909751
Journal volume & issue
Vol. 7
pp. 495 – 502

Abstract

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We fabricated a field-effect transistor (FET) with a gate length of 21 nm whose channel material is a c-axis-aligned crystalline In-Ga-Zn oxide (CAAC-IGZO). A CAAC-IGZO FET with a gate length of 21 nm has an extremely low off-state leakage current, a practical driving capability, and tolerance against high temperatures. CAAC-IGZO FETs enable low-power integrated circuits, such as logic and memory in high-temperature environments. Performance estimation of a memory cell using the CAAC-IGZO FET with a gate length of 21 nm revealed that a write time of less than 1 ns and a data retention time of more than 1 h would be possible at 85 °C.

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