IEEE Journal of the Electron Devices Society (Jan 2017)

A Novel Sealing Redistribution Layer Approach for Through-Glass via Fabrication

  • Shih-Wei Lee,
  • Geng-Ming Chang,
  • Ching-Yun Chang,
  • Kuan-Neng Chen

DOI
https://doi.org/10.1109/JEDS.2017.2649605
Journal volume & issue
Vol. 5, no. 2
pp. 132 – 135

Abstract

Read online

A sealing redistribution layer (RDL) approach for the interposer fabrication is developed to simplify the conventional bottom-up process flow. By using this approach, bottom-up plating can achieve the integration of Cu-filler plating and its bottom RDL simultaneously. In this paper, through-glass via in glass interposer or 3-D integration is fabricated using the proposed approach. The electrical measurement and reliability tests indicate that the proposed approach can be an attractive candidate for interposer fabrication with great performance.

Keywords