InGaAs FinFETs 3-D Sequentially Integrated on FDSOI Si CMOS With Record Performance

Abstract

In this paper, we demonstrate InGaAs FinFETs 3-D sequentially (3DS) integrated on top of a fully depleted silicon-on-insulator CMOS. Top layer III-V FETs are fabricated using a Si CMOS compatible HKMG replacement gate flow and self-aligned raised source-drain regrowth. We demonstrate that the low thermal budget of the top layer process does not affect the lower level FETs performance. An on-current of 200 μA/μm (at IOFF = 100 nA/μm and VDD = 0.5 V) is achieved, representing the highest reported for 3DS integrated III-V FETs on silicon, showing a 50% improvement in RON compared to previous work. The achieved improved performance can be attributed to the introduction of spacers, doped extensions underneath the gate region as well as improvements in the direct wafer bonding technique.

Keywords

• 3DS
• III-V
• FinFETs
• sequential integration
• wafer bonding
• monolithic integration