IEEE Journal of the Electron Devices Society (Jan 2023)

Compensation of Hot Carrier Degradation Enabled by Forward Back Bias in π-GAA-π MOSFET

  • Yijun Qian,
  • Qiang Liu,
  • Jialun Yao,
  • Xiaowei Wang,
  • Amit Kumar Shukla,
  • Fengyu Liu,
  • Tao Wu,
  • Kai Lu,
  • Yemin Dong,
  • Xing Wei,
  • Wenjie Yu,
  • Zhiqiang Mu,
  • Yumeng Yang

DOI
https://doi.org/10.1109/JEDS.2023.3278936
Journal volume & issue
Vol. 11
pp. 319 – 324

Abstract

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Forward back biasing (FBB) technique is considered as a potential solution for aging compensation in silicon on insulator (SOI) MOSFET. However, traditional SOI devices under FBB would suffer from extra off-state leakage current $(I_{\mathrm{ off}})$ and undesirable static power consumption. In this work, we studied the hot carrier degradation and FBB compensation in $\pi $ -GAA- $\pi $ MOSFET. With the unique hybrid gate structure, the performance degradation is found to be less severe than pure $\pi $ gate device; and moreover it can be partially recovered by FBB without the sacrifice of $I_{\mathrm{ off}}$ . The presence of $\pi $ gates offer the back gate tunability that is not provided by pure GAA gate; while the GAA gate component can effectively prevent the impact of FBB from affecting the surface potential. Our findings in $\pi $ -GAA- $\pi $ hybrid gate MOSFETs would be beneficial for device reliability improvement.

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