IEEE Journal of the Electron Devices Society (Jan 2017)

Dimension Effect on Breakdown Voltage of Partial SOI LDMOS

  • Yue Hu,
  • Huazhen Liu,
  • Qianqian Xu,
  • Luwen Wang,
  • Jing Wang,
  • Shichang Chen,
  • Peng Zhao,
  • Ying Wang,
  • Gaofeng Wang

DOI
https://doi.org/10.1109/JEDS.2017.2690363
Journal volume & issue
Vol. 5, no. 3
pp. 157 – 163

Abstract

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Dimension effect on breakdown voltage (BV) of lateral double-diffused metal-oxide- semiconductor field-effect transistor in partial silicon-on-insulator (PSOI) technology is comprehensively studied. The maximum BV (BVmax) is examined under various settings of the device length L and the active silicon film thickness t. It is shown that there exists an optimal pair of (L, t) for PSOI at which the highest BV can be achieved. The ratio of L/t is better chosen between 5 and 7 for the device designs, in particular, L/t = 6 can be considered as the optimal one theoretically. Moreover, impacts of the silicon window length Lw and the drift doping concentration Ndr on the BV, the on-resistance (Ron) and the figure-of-merit (=BV2/Ron) are also carefully studied.

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