IEEE Journal of the Electron Devices Society (Jan 2017)
Dimension Effect on Breakdown Voltage of Partial SOI LDMOS
Abstract
Dimension effect on breakdown voltage (BV) of lateral double-diffused metal-oxide- semiconductor field-effect transistor in partial silicon-on-insulator (PSOI) technology is comprehensively studied. The maximum BV (BVmax) is examined under various settings of the device length L and the active silicon film thickness t. It is shown that there exists an optimal pair of (L, t) for PSOI at which the highest BV can be achieved. The ratio of L/t is better chosen between 5 and 7 for the device designs, in particular, L/t = 6 can be considered as the optimal one theoretically. Moreover, impacts of the silicon window length Lw and the drift doping concentration Ndr on the BV, the on-resistance (Ron) and the figure-of-merit (=BV2/Ron) are also carefully studied.
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