IEEE Journal of the Electron Devices Society (Jan 2023)
3-D Self-Aligned Stacked Ge Nanowire pGAAFET on Si nFinFET of Single Gate CFET
Abstract
In this study, we propose a self-aligned stacked Ge nanowire (NW) p-type gate-all-around field-effect transistor (pGAAFET) on Si nFinFET of single gate complementary FET (CFET). The self-aligned stacked Ge NW pGAAFET on Si nFinFET of single gate CFET device is fabricated on a SOI wafer. The CFET device is fully compatible with current Si technology platform using alternating anisotropic and isotropic dry etching process. The Ge NW pGAAFET presents an on-state current (ION) of $166 ~\mu \text{A}/\mu \text{m}$ at ${\mathrm{ V}}_{\mathrm{ D}}\,\,=$ VG-VTH $=\,\,-0.5$ V and shows minimum subthreshold swing (SSmin) of 79, 91 mV/dec, and ION/IOFF of $3.03\times10\,\,^{\mathrm{ 5}}$ , $3.4\times 10^{4}$ at ${\mathrm{ V}}_{\mathrm{ D}}\,\,=\,\,-0.05$ V and −0.5 V, respectively. The Si nFinFET presents an ${\mathrm{ I}}_{\mathrm{ ON}}$ of $60.4 ~\mu \text{A}/\mu \text{m}$ at ${\mathrm{ V}}_{\mathrm{ D}}\,\,=$ VG-VTH = 0.5 V and shows ${\mathrm{ SS}}_{\min }$ of 91, 101 mV/dec, and ION/IOFF of $9.01\times10\,\,^{\mathrm{ 4}}$ , $5.62\times 10^{5}$ at ${\mathrm{ V}}_{\mathrm{ D}}\,\,=$ 0.05 V and 0.5 V, respectively. The proposed CFET can simplify the process and shows promising potential for extending scaling beyond the technology node.
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