Low-Temperature Solution-Processed All Organic Integration for Large-Area and Flexible High-Resolution Imaging

Xiao Hou; Sujie Chen; Wei Tang; Jianghu Liang; Bang Ouyang; Ming Li; Yawen Song; Tong Shan; Chun-Chao Chen; Patrick Too; Xiaoqing Wei; Libo Jin; Gang Qi; Xiaojun Guo

doi:10.1109/JEDS.2022.3142769

IEEE Journal of the Electron Devices Society (Jan 2022)

Low-Temperature Solution-Processed All Organic Integration for Large-Area and Flexible High-Resolution Imaging

Xiao Hou,
Sujie Chen,
Wei Tang,
Jianghu Liang,
Bang Ouyang,
Ming Li,
Yawen Song,
Tong Shan,
Chun-Chao Chen,
Patrick Too,
Xiaoqing Wei,
Libo Jin,
Gang Qi,
Xiaojun Guo

Affiliations

Xiao Hou: ORCiD; School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, China
Sujie Chen: ORCiD; School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, China
Wei Tang: ORCiD; School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, China
Jianghu Liang: School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, China
Bang Ouyang: ORCiD; School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, China
Ming Li: School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, China
Yawen Song: School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, China
Tong Shan: ORCiD; School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, China
Chun-Chao Chen: School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai, China
Patrick Too: FlexEnable, Cambridge, U.K.
Xiaoqing Wei: iRay Technology, Shanghai, China
Libo Jin: iRay Technology, Shanghai, China
Gang Qi: Tianma Microelectronics, Shanghai, China
Xiaojun Guo: ORCiD; School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, China

DOI: https://doi.org/10.1109/JEDS.2022.3142769
Journal volume & issue: Vol. 10
pp. 821 – 826

Abstract

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A facile blade-coating process is developed for large area deposition of uniform thick organic active layers in organic photodiodes (OPDs). Large-area semi-transparent top metal electrodes are thermally evaporated with an optimal deposition rate to achieve good balance between transparency and conductivity for top illumination integration structure with the organic thin-film transistor (OTFT) backplane. The maximum process temperature of the OPD is 85 °C, so that the performance of the OTFT underneath is not affected. Based on the developed integration structure and processes, an all-organic integrated flexible active-matrix imager is developed, having the largest size (130 mm ${\times } 130$ mm), highest resolution ( $1536 {\times } 1536$ pixels, 300 ppi) and lowest process temperature (100 °C) reported so far for the OPD based imagers.

Published in IEEE Journal of the Electron Devices Society

ISSN: 2168-6734 (Online)
Publisher: IEEE
Country of publisher: United States
LCC subjects: Technology: Electrical engineering. Electronics. Nuclear engineering
Website: https://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=6245494

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