Removal Ability of <i>Bacillus licheniformis</i> on Waxy Cuticle on Wheat Straw Surface

Abstract

The outermost surface of wheat straw (WS) is covered with hydrophobic lipophilic extracts and silica, which affects follow-up processes such as impregnation pretreatment of pulping and papermaking. In this study, a strain named Bacillus licheniformis (B. licheniformis) was screened from the black liquor of papermaking, which was used to explore the effect of its treatment on the waxy cuticle of WS. Scanning electron microscope-energy dispersive spectroscopy (SEM-EDS) showed that the B. licheniformis had a certain destructive effect on the outer surface of WS and the content of Si on the outer surface decreased by 80%. The results of FTIR and X-ray photoelectron spectroscopy (XPS) displayed that the wax composition on the outer surface of WS decreased and the fiber structure inside appeared. The mechanical properties of paper demonstrated that the treated WS is still feasible in this field and the content of Si in the black liquor is reduced by 33%. Therefore, the WS treated by B. licheniformis can destroy the waxy cuticle on its outer surface and improve the wettability of WS. It provides a new idea to alleviate the “Si interference” problem of alkali recovery in WS traditional pulping and papermaking.

Keywords

• <i>Bacillus licheniformis</i>
• waxy cuticle
• wheat straw
• papermaking
• black liquor
• Si interference